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  ? semiconductor components industries, llc, 2015 june, 2015 ? rev. 3 1 publication order number: mc74hc151a/d mc74hc151a 8-input data selector/multiplexer high?performance silicon?gate cmos the mc74hc151 is identical in pinout to the ls151. the device inputs are compatible with standard cmos outputs; with pullup resistors, they are compatible with lsttl outputs. this device selects one of the eight binary data inputs, as determined by the address inputs. the strobe pin must be at a low level for the selected data to appear at the outputs. if strobe is high, the y output is forced to a low level and the y output is forced to a high level. the hc151 is similar in function to the hc251 which has 3?state outputs. features ? output drive capability: 10 lsttl loads ? outputs directly interface to cmos, nmos, and ttl ? operating voltage range: 2 to 6 v ? low input current: 1  a ? high noise immunity characteristic of cmos devices ? nlv prefix for automotive and other applications requiring unique site and control change requirements; aec?q100 qualified and ppap capable ? these are pb?free devices figure 1. logic diagram d0 d1 d2 d3 d4 d5 d6 d7 a0 a1 a2 strobe y y data outputs data inputs address inputs 5 6 4 3 2 1 15 14 13 12 11 10 9 7 pin 16 = v cc pin 8 = gnd www. onsemi.com marking diagrams soic?16 d suffix case 751b tssop?16 dt suffix case 948f 1 16 1 16 hc151ag awlyww hc 151a alyw   1 16 a = assembly location wl, l = wafer lot yy, y = year ww, w = work week g or  = pb?free package see detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. ordering information (note: microdot may be in either location) 13 14 15 16 9 10 11 12 5 4 3 2 1 8 7 6 d3 d0 d1 d2 strobe y y gnd d7 d6 d5 d4 v cc a1 a0 a2 pin assignment function table inputs outputs a2 a1 a0 strobe y y xxx h lh l l l l d0 d0 l l h l d1 d1 l h l l d2 d2 l h h l d3 d3 h l l l d4 d4 h l h l d5 d5 h h l l d6 d6 h h h l d7 d7 d0, d1, , d7 = the level of the respective d input . 1 1 6
mc74hc151a www. onsemi.com 2 maximum ratings symbol parameter value unit v cc dc supply voltage (referenced to gnd) ?0.5 to +7.0 v v in dc input voltage (referenced to gnd) ?0.5 to v cc + 0.5 v v out dc output voltage (referenced to gnd) ?0.5 to v cc + 0.5 v i in dc input current, per pin 20 ma i out dc output current, per pin 25 ma i cc dc supply current, v cc and gnd pins 50 ma p d power dissipation in still air soic package tssop package 500 tbd mw t stg storage temperature ?65 to +150 c stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. recommended operating conditions symbol parameter min max unit v cc dc supply voltage (referenced to gnd) 2.0 6.0 v v in , v out dc input voltage, output voltage (referenced to gnd) 0 v cc v t a operating temperature, all package types ?55 +125 c t r , t f input rise and fall time v cc = 2.0 v (figure 2) v cc = 4.5 v v cc = 6.0 v 0 0 0 1000 500 400 ns functional operation above the stresses listed in the recommended operating ranges is not implied. extended exposure to stresses beyond the recommended operating ranges limits may affect device reliability. dc electrical characteristics (voltages referenced to gnd) symbol parameter test conditions v cc v guaranteed limit unit ? 55 to 25 c  85 c  125 c v ih minimum high?level input voltage v out = 0.1 v or v cc ? 0.1 v |i out |  20  a 2.0 4.5 6.0 1.5 3.15 4.2 1.5 3.15 4.2 1.5 3.15 4.2 v v il maximum low?level input voltage v out = 0.1 v or v cc ? 0.1 v |i out |  20  a 2.0 4.5 6.0 0.3 0.9 1.2 0.3 0.9 1.2 0.3 0.9 1.2 v v oh minimum high?level output voltage v in = v ih or v il |i out |  20  a 2.0 4.5 6.0 1.9 4.4 5.9 1.9 4.4 5.9 1.9 4.4 5.9 v v in = v ih |i out |  4.0 ma |i out |  5.2 ma 4.5 6.0 3.98 5.48 3.84 5.34 3.70 5.20 v ol maximum low?level output voltage v in = v ih or v il |i out |  20  a 2.0 4.5 6.0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 v v in = v ih or v il |i out |  4.0 ma |i out |  5.2 ma 4.5 6.0 0.26 0.26 0.33 0.33 0.40 0.40 i in maximum input leakage current v in = v cc or gnd 6.0 0.1 1.0 1.0  a i cc maximum quiescent supply current (per package) v in = v cc or gnd i out = 0  a 6.0 8 80 160  a this device contains protection circuitry to guard against damage due to high static voltages or electric fields. however, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high?impedance cir- cuit. for proper operation, v in and v out should be constrained to the range gnd  (v in or v out )  v cc . unused inputs must always be tied to an appropriate logic voltage level (e.g., either gnd or v cc ). unused outputs must be left open.
mc74hc151a www. onsemi.com 3 ac electrical characteristics (c l = 50 pf, input t r = t f = 6 ns) symbol parameter v cc v guaranteed limit unit ? 55 to 25 c  85 c  125 c t plh , t phl maximum propagation delay, input d to output y (figures 2 and 7) 2.0 4.5 6.0 170 34 29 215 43 37 255 51 43 ns t plh , t phl maximum propagation delay, input d to output y (figures 4 and 7) 2.0 4.5 6.0 185 37 31 230 46 39 280 56 48 ns t plh , t phl maximum propagation delay, input d to output y (figures 3 and 7) 2.0 4.5 6.0 185 37 31 230 46 39 280 56 48 ns t plh , t phl maximum propagation delay, input a to output y (figures 3 and 7) 2.0 4.5 6.0 205 41 35 255 51 43 310 62 53 ns t plh , t phl maximum propagation delay, input d to output y (figures 5 and 7) 2.0 4.5 6.0 125 25 21 155 31 26 190 38 32 ns t plh , t phl maximum propagation delay, strobe to output y (figures 6 and 7) 2.0 4.5 6.0 125 25 21 155 31 26 190 38 32 ns t tlh , t thl maximum output transition time, any output (figures 2, 4 and 7) 2.0 4.5 6.0 75 15 13 95 19 16 110 22 19 ns c in maximum input capacitance ? 10 10 10 pf c pd power dissipation capacitance (per package) typical @ 25 c, v cc = 5.0 v pf 36 pin descriptions inputs d0, d1, , d7 (pins 4, 3, 2, 1, 15, 14, 13, 12) data inputs. data on any one of these eight binary inputs may be selected to appear on the output. control inputs a0, a1, a2 (pins 11, 10, 9) address inputs. the data on these pins are the binary address of the selected input (see the function table). strobe (pin 7) strobe. this input pin must be at a low level for the selected data to appear at the outputs. if the strobe pin is high, the y output is forced to a low level and the y output is forced to a high level. outputs y, y (pins 5, 6) data outputs. the selected data is presented at these pins in both true (y output) and complemented (y output) forms.
mc74hc151a www. onsemi.com 4 switching waveforms strobe y figure 2. figure 3. figure 4. t r t f t phl t plh t thl t tlh strobe 10% 50% v cc gnd t f t r input d output y 10% 50% 90% 10% 50% 90% t tlh t plh t phl t thl t r t f v cc gnd input d output y t phl t plh t thl t tlh 10% 50% 90% 10% 50% 90% t f t r v cc gnd 10% 50% 90% t phl t plh 10% 50% 90% t thl t tlh v cc gnd v cc gnd 50% input a t plh t phl 50% output y or y 10% 50% 90% 90% y *includes all probe and jig capacitance c l * test point device under test output figure 5. figure 6. figure 7. test circuit valid valid
mc74hc151a www. onsemi.com 5 y y 5 6 d0 d1 d2 d3 d4 d5 d6 d7 a0 a1 a2 4 3 2 1 15 14 13 12 11 10 9 7 data inputs figure 8. expanded logic diagram data outputs address inputs strobe ordering information device package shipping ? mc74hc151adg soic?16 (pb?free) 48 units / rail mc74hc151adr2g 2500 tape & reel NLV74HC151ADR2G* 2500 tape & reel mc74hc151adtg tssop?16 (pb?free) 96 units / tube mc74hc151adtr2g 2500 tape & reel nlv74hc151adtr2g* 2500 tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d. *nlv prefix for automotive and other applications requiring unique site and control change requirements; aec?q100 qualified and ppap capable.
mc74hc151a www. onsemi.com 6 package dimensions tssop?16 dt suffix case 948f issue b ??? ??? ??? dim min max min max inches millimeters a 4.90 5.10 0.193 0.200 b 4.30 4.50 0.169 0.177 c ??? 1.20 ??? 0.047 d 0.05 0.15 0.002 0.006 f 0.50 0.75 0.020 0.030 g 0.65 bsc 0.026 bsc h 0.18 0.28 0.007 0.011 j 0.09 0.20 0.004 0.008 j1 0.09 0.16 0.004 0.006 k 0.19 0.30 0.007 0.012 k1 0.19 0.25 0.007 0.010 l 6.40 bsc 0.252 bsc m 0 8 0 8 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a does not include mold flash. protrusions or gate burrs. mold flash or gate burrs shall not exceed 0.15 (0.006) per side. 4. dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5. dimension k does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the k dimension at maximum material condition. 6. terminal numbers are shown for reference only. 7. dimension a and b are to be determined at datum plane ?w?.  section n?n seating plane ident. pin 1 1 8 16 9 detail e j j1 b c d a k k1 h g s u 0.15 (0.006) t s u 0.15 (0.006) t s u m 0.10 (0.004) v s t 0.10 (0.004) ?t? ?v? ?w? 0.25 (0.010) 16x ref k n n 7.06 16x 0.36 16x 1.26 0.65 dimensions: millimeters 1 pitch soldering footprint* *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d.
mc74hc151a www. onsemi.com 7 package dimensions soic?16 case 751b?05 issue k notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.127 (0.005) total in excess of the d dimension at maximum material condition. 18 16 9 seating plane f j m r x 45  g 8 pl p ?b? ?a? m 0.25 (0.010) b s ?t? d k c 16 pl s b m 0.25 (0.010) a s t dim min max min max inches millimeters a 9.80 10.00 0.386 0.393 b 3.80 4.00 0.150 0.157 c 1.35 1.75 0.054 0.068 d 0.35 0.49 0.014 0.019 f 0.40 1.25 0.016 0.049 g 1.27 bsc 0.050 bsc j 0.19 0.25 0.008 0.009 k 0.10 0.25 0.004 0.009 m 0 7 0 7 p 5.80 6.20 0.229 0.244 r 0.25 0.50 0.010 0.019  6.40 16x 0.58 16x 1.12 1.27 dimensions: millimeters 1 pitch soldering footprint* 16 89 8x *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. on semiconductor and are registered trademarks of semiconductor co mponents industries, llc (scillc). scillc owns the rights to a numb er of patents, trademarks, copyrights, trade secrets, and other inte llectual property. a listing of scillc?s pr oduct/patent coverage may be accessed at ww w.onsemi.com/site/pdf/patent?marking.pdf. scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and s pecifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typical s? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or a uthorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in whic h the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or us e scillc products for any such unintended or unauthorized appli cation, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unin tended or unauthorized use, even if such claim alleges that scil lc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyrig ht laws and is not for resale in any manner. p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 mc74hc151a/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative


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